USHIO INC. has kicked off shipping the world's first 200-mm wafer full-field projection lithography tool "UX4-LEDs FFPL 200" for manufacturing High-Brightness LED chips.
Additionally, the company has completed development of the laser lift-off system "UX4-LEDs LLO 150" for volume manufacturing of vertical-structure LED chips.
These latest models of the UX4-LEDs are based on the same platform as USHIO's field-proven UX series, which has an installed base of more than 1,100 systems.
They will be exhibited through a panel display at SEMICON West 2011 held on July 12 through July 14.
