Microsolar Corp. provides a copper-aluminum bonding Service and products. With the state-of-the-art technology called copper-aluminum bonding, Microsolar's LED lamps are allowed to input over 1.5Amp current into a 40milx40mil single chip with over 250 lm brightness.

The company says the melting point of copper is 1083C; however, the melting point of aluminum is 550C. Therefore, it is extremely difficult to bond the two metals. Without excellent bonding interface of copper and aluminum, the heat can't spread from copper slug into aluminum smoothly. Therefore, the heat of LED chip accumulates within copper. Finally, LED chip fails because of overheat.

Besides, Microsolar are also developing 200W LED module for street lamp. With excellent thermal spreading by Copper-Aluminum bonding, the 200 pieces of LED chips can provide over 14000 lm. In the near future, we can see more LED Street Lamps than traditional street Lamps.