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[News] MACOM Demonstrates Technologies Enabling the Future of High Speed Connectivity at ECOC 2026

2026-09-16 06: 31

MACOM Technology Solutions Inc. (“MACOM”), a leading supplier of semiconductor products, today announced it will showcase its latest optical and high speed connectivity technologies at the European Conference on Optical Communication (ECOC) 2026, taking place September 21 - 23, 2026, in Málaga, Spain. Visitors to Stand 1055 can learn about MACOM’s broad portfolio of solutions designed to support the growing bandwidth, performance and power efficiency demands of AI infrastructure, cloud data centers, telecommunications networks and emerging optical architectures.


MACOM continues to advance the critical analog and optoelectronic technologies that enable more efficient data transmission throughout datacenter AI networks. The company will demonstrate its IC solutions in a variety of applications in optical transceivers, active copper cables, PCIe interconnects, coherent networking, optical access networks and near packaged optics (NPO).

“Demand for higher bandwidth and lower power consumption continues to drive innovation across the optical communications ecosystem. We’re excited to showcase our portfolio which is helping customers build the next generation of optical and connectivity infrastructure,” said Stephen G. Daly, President and Chief Executive Officer, MACOM.

Featured Demonstrations
MACOM will present live demonstrations featuring:

  • 3.2T Optical Solutions, featuring 448 Gbps/lane modulator drivers, transimpedance amplifiers and photodetectors.
  • 1.6T Active Copper Cable Solution, demonstrating 224 Gbps/lane equalizers and cable drivers designed to deliver high speed copper connectivity.
  • 1.6T Optical Products incorporating 224 Gbps/lane photodetectors, laser drivers and transimpedance amplifiers.
  • PCIe Connectivity showcasing Optical PCIe® 6.0 and Copper PCIe® 7.0 technologies for next generation compute and storage architectures.
  • NPO featuring 112 and 226 Gbps/lane drivers, transimpedance amplifiers and photodetectors.
  • 800G Scale Out Networks utilizing 400 Gbps-per-wavelength coherent drivers and transimpedance amplifiers.
  • 5G Advanced and 6G Fronthaul highlighting linear drivers and TIAs for SFP56/SFP112 LPO.

Additional Product Display
MACOM will also feature a dedicated display highlighting its technologies for:

  • Free Space Optics (FSO) applications supporting high speed optical communication links.
  • RF over Fiber (RFoF) solutions that enable the transport of radio frequency signals over optical fiber for communications, satellite communications and other high performance networking applications.

Visit MACOM at ECOC 2026
Event: European Conference on Optical Communication (ECOC) 2026
Dates: September 21 - 23, 2026
Location: Málaga, Spain
Stand: 1055

TrendForce 2026 Infrared Sensing Application Market and Branding Strategies
Release: 01 January 2026
Format: PDF / EXCEL
Language: Traditional Chinese / English
Page: 168

If you would like to know more details , please contact:

Global Contact:
 
ShenZhen:
Grace Li
E-mail :  Graceli@trendforce.com
Tel : +886-2-8978-6488 ext.916
  Perry Wang
E-mail :  Perrywang@trendforce.cn
Tel : +86-755-82838931 ext.6800
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